&#8226; &nbsp;Single-piece chamber construction<br />
&#8226; &nbsp;1,000W, 13.56MHz RF ICP Power<br />
&#8226; &nbsp;600W, 13.56 MHz RF Bias Power<br />
&#8226; &nbsp;Auto RF matching<br />
&#8226; &nbsp;Downstream pressure control<br />
&#8226; &nbsp;Computer control with Windows 2000 operating software<br />
&#8226; &nbsp;Pumping: Mechanical and turbo pumps for etching; mechanical pump with roots blower for deposition<br />
&#8226; &nbsp;Field proven components<br />
&#8226; &nbsp;Proven process recipes<br />
&#8226; &nbsp;Endpoint detection (optional)